YXC75H Series

0R1

0.1

A 

B

C 

D

50V

2R0

2.0

A

B

C

D

50V

100

10

F
G
J
K

50V

0R2

0.2

2R1

2.1

110

11

0R3

0.3

2R2

2.2

120

12

0R4

0.4

2R4

2.4

130

13

0R5

0.5

2R7

2.7

150

15

0R6

0.6

3R0

3.0

160

16

0R7

0.7

3R3

3.3

180

18

0R8

0.8

3R6

3.6

200

20

0R9

0.9

3R9

3.9

220

22

1R0

1.0

4R3

4.3

240

24

1R1

1.1

4R7

4.7

270

27

1R2

1.2

5R1

5.1

1R3

1.3

5R6

5.6

1R4

1.4

6R2

6.2

1R5

1.5

6R8

6.8

B 

C

J

K

1R6

1.6

7R5

7.5

1R7

1.7

8R2

8.2

1R8

1.8

9R1

9.1

1R9

1.9

Quality Factors(Q)

2000 min.

Insulation Resistance(IR)

105 Megohms min. @ +25°C at rated WVDC.  104 Megohms min. @ +125°C at rated WVDC.

Rated Voltage(WVDC)

50V

Dielectric Withstanding Voltage (DWV)

250% of rated Voltage for 5 seconds.

Operating Temperature Range

－55℃ to +125℃

Temperature Coefficient(TC)

0±30ppm/℃

Capacitance Drift

±0.02% or ±0.02pF, whichever is greater.

Piezoelectric Effects

None

Terminal Adhesion

Temrination should not pull off,      Cemera should remain undamaged

Linear pull force exerted on axial leads soldered to each terninal 2.0lbs

Resistance to soldering heat

No mechanical damage Capacitance change:-1.0%~+2.0%  Q>500  I.R.>10 G Ohms  breakdown voltage:2.5 X WVDC

Preheat device to 150°C-180°C for 60sec  DIP in 260°C±5°C solder for 10±1 sec.Measure after 24±2 hours cooling period

Thermal Shock

No mechanical damage  Capacitance change:±5% or 0.5pF max   Q>2000  I.R.>10 G ohms   breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 107, Condition A.  At the maximum rated temperature(-55℃ and 125℃) stay 30 minutes.The time of removing shall be not more than 3 minutes. Perform the five cycles.

Humidity     (steady state)

No mechanical damage Capacitance change:±5% or 0.5pF max  Q>300 I.R.>10 G ohms breakdown voltage:2.5 X WVDC

MIL-STD-202.Method 106

Low voltage hummidity

No mechanical damage  Capacitance change:±3% or 0.3pF max Q>300  I.R.>10 G ohms  breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 103, Condition A, with 1.5 Volts D.C. applied while subjected to an environment of 85°C with 85% relative humidity for 240 hours min.

Life

No mechanical damage Capacitance change:±2% or 0.5pF max Q>500  I.R.>10 G ohmsbreakdown voltage:2.5 X WVDC

MIL-STD-202, Method 108, for 2000 hours, at 125℃.    200% Rated voltage D.C. applied.

Chip Dimension

0.040 (1.02)

0.020(0.51)

0.020(0.51)