YXC75P Series

0R1

0.1

A

B

C 

D

250V

2R2

2.2

A 

B 

C 

D

250V

160

16

F

G

J

K

250V

0R2

0.2

2R4

2.4

180

18

0R3

0.3

2R7

2.7

200

20

0R4

0.4

3R0

3.0

220

22

0R5

0.5

3R3

3.3

240

24

0R6

0.6

3R6

3.6

270

27

0R7

0.7

3R9

3.9

300

30

0R8

0.8

4R3

4.3

360

36

0R9

0.9

4R7

4.7

390

39

1R0

1.0

5R1

5.1

430

43

1R1

1.1

5R6

5.6

470

47

1R2

1.2

6R2

6.2

510

51

1R3

1.3

6R8

6.8

B

C

J  

K

560

56

1R4

1.4

7R5

7.5

620

62

1R5

1.5

8R2

8.2

680

68

1R6

1.6

9R1

9.1

750

75

1R7

1.7

100

10

F

G

J

K

820

82

1R8

1.8

110

11

910

91

1R9

1.9

120

12

101

100

2R0

2.0

130

13

2R1

2.1

150

15

Quality Factors(Q)

2000 min.

Insulation Resistance(IR)

105 Megohms min. @ +25°C at rated WVDC. 

104 Megohms min. @ +125°C at rated WVDC.

Rated Voltage(WVDC)

250V

Dielectric Withstanding Voltage (DWV)

250% of rated Voltage for 5 seconds.

Operating Temperature Range

－55℃ to +125℃

Temperature Coefficient(TC)

0±30ppm/℃

Capacitance Drift

±0.02% or ±0.02pF, whichever is greater.

Piezoelectric Effects

None

Terminal Adhesion

Temrination should not pull off,      Cemera should remain undamaged

Linear pull force exerted on axial leads soldered to each terninal 2.0lbs

Resistance to soldering heat

No mechanical damage  Capacitance change:-1.0%~+2.0% 

 Q>500  I.R.>10 G Ohms     breakdown voltage:2.5 X WVDC

Preheat device to 150°C-180°C for 60sec  DIP in 260°C±5°C solder for 10±1 sec.Measure after 24±2 hours cooling period

Thermal Shock

No mechanical damage Capacitance change:±5% or 0.5pF max  

 Q>500   I.R.>10 G ohms 

breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 107, Condition A. At the maximum rated temperature(-55℃ and 125℃) stay 30 minutes.The time of removing shall be not more than 3 minutes. Perform the five cycles.

Humidity         (steady state)

No mechanical damage   

 Capacitance change:±5% or 0.5pF max 

 Q>300   I.R.>10

G ohms     breakdown voltage:2.5 X WVDC

MIL-STD-202.Method 106

Low voltage hummidity

No mechanical damage Capacitance change:±3% or 0.3pF max 

 Q>300   I.R.>10 G ohms   breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 103, Condition A, with 1.5 Volts D.C. applied while subjected to an environment of 85°C with 85% relative humidity for 240 hours min.

Life

No mechanical damage  Capacitance change:±2% or 0.5pF max 

 Q>500     I.R.>10 G ohms breakdown voltage:2.5 X WVDC

MIL-STD-202, Method 108, for 1000 hours, at 125℃.  200% Rated voltage D.C. applied.

Chip Dimension

0.060 (1.52)

0.030(0.81)

0.030(0.76)